Application of Thermal Conductivity Tester in Resin Industry

The thermal conductivity coefficient, as a core thermal property parameter that characterizes the thermal conductivity of materials, is a key indicator for measuring the thermal conductivity performance of materials. Its accurate measurement is of great significance for material selection, thermal management design, and performance optimization. In the research and development of resin materials, thermal conductivity is not only the basic data for evaluating the thermal performance of materials, but also an important basis for guiding the optimization of composite processes for high thermal conductivity fillers (such as boron nitride, carbon based fillers, etc.) and achieving accurate control of material thermal conductivity.

1、 Experimental principle

The transient planar heat source method is a thermal conductivity testing method based on transient technology. Its core principle is to use a transient planar heat source sensor as both a heating source and a temperature sensor. By measuring the temperature variation of the sensor over time in real time, the thermal conductivity and thermal diffusion coefficient of the material can be calculated. This method has formed a complete standard system, mainly based on specifications such as GB/T32064-2015 and ISO22007-2:2022.

2、 Experimental steps

1. Materials and Equipment

Material: Acrylic sheet (PMMA) was used as the sample for this test.

Instrument: DZDR-AS Thermal Conductivity Tester

2. Experimental steps

2.1 First, make the sample into two pieces with a size of 30 * 30 * 7.5, with a smooth and flat surface without any protrusions.

2.2 Open the thermal conductivity testing equipment and preheat the equipment.

2.3 Place the probe in the middle of two samples and secure it with a fixture.

2.4 Select different probes, set different experimental time, test power and other experimental parameters according to the properties of the sample.

2.5 After the experiment is completed, the results will be automatically analyzed and data will be generated.

2.6 Data Analysis

As shown in the figure below, the sample is the result of continuous testing of acrylic board using cyclic function twice. By giving a certain power to the probe, the temperature change around the probe is detected, and the thermal conductivity is calculated by formula. At the same time, the instrument can test the specific heat capacity and thermal resistance of the sample.

3、 Application of Thermal Conductivity Meter in Resin Industry

1. Electronic packaging and thermal management materials

Thermal conductive adhesive and potting resin: Test the thermal conductivity of thermal conductive silicone grease and epoxy potting adhesive, optimize the formula to improve chip heat dissipation efficiency. For example, TPS testing can quickly screen the thermal conductivity of resins with high filler content, ensuring the stability of electronic components at high power.

Encapsulation substrate and composite materials: Evaluating the thermal anisotropy of carbon fiber reinforced resin based composite materials to guide the lightweight design of aerospace electronic equipment.

2. Research and quality control of composite materials

Performance evaluation of resin matrix: Real time monitoring of changes in thermal conductivity during the curing process of thermosetting resins (such as phenolic and epoxy) to optimize curing process parameters.

Production process testing: By quickly testing the thermal conductivity consistency of resin samples on the production line, batch quality control can be achieved and the defect rate can be reduced.

4、 Experimental Summary

The thermal conductivity tester, as the "gold standard" for evaluating the thermal properties of resin materials, holds a core position due to its standardized testing method system, accurate measurement capability, and wide applicability. The transient planar heat source method can comprehensively characterize the thermal conductivity of resin materials, covering different material types ranging from low to high thermal conductivity, meeting the diverse testing needs of laboratory research and industrial production.