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152025-09
Thermal conductivity tester for measuring the thermal conductivity of adhesive
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Synchronous thermal analysis technology can simultaneously measure the thermogravimetric (TG) and differential thermal analysis (DTA) or differential scanning calorimetry (DSC) information of ceramic materials under the same experimental conditions, providing accurate data support for studying the changes of ceramic materials during heating.
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The thermal conductivity coefficient, as a core thermal property parameter that characterizes the thermal conductivity of materials, is a key indicator for measuring the thermal conductivity performance of materials. Its accurate measurement is of great significance for material selection, thermal management design, and performance optimization.
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Thermogravimetric analysis (TGA) can effectively evaluate the curing degree, thermal stability, composition, and aging behavior of epoxy resins by accurately measuring the quality changes of materials under programmed temperature control environment. It is a core technical means for material research and development, process optimization, and quality control.
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Nanjing Dazhan Testing Instrument Co., Ltd., located in Jiulong Lake, Jiangning District, Nanjing, is a high-tech enterprise integrating scientific research, production, and sales.
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